半导体器件物理习题与参考文献 下载本文

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18. 19. 20. 21.

Singh, J.Semiconductor Devices: An Introduction.New York: McGraw-Hill, 1994 Sze, S.M.High-Speed Semiconductor Devices.New York: Wiley, 1990.

Sze, S.M.Physics of Semiconductor Devices.2nd ed.New York: Wiley, 1981. Tiwari, S., S.L.Wright, and A.W.Kleinsasser.“Transport and Related Properties of (Ga, Al)As/GaAs Double Heterojunction Bipolar Junction Transistors.” IEEE Transactions on Electron Devices, ED-34(February 1987), pp.185-87. Taur, Y., and T.H.Ning.Fundamentals of Modern VLSI Devices.New York: Cambridge University Press, 1998. Wang, S.Fundamentals of Semiconductor Theory and Device Physics.Englewood Cliffs, NJ: Prentice Hall, 1989. Warner, R.M., Jr., and B.L.Grung.Transistors: Fundamentals for the Integrated-Circuit Engineer.New York: Wiley, 1983.

Yang, E.S.Microelectronic Devices.New York: McGraw-Hill, 1988.

第四章习题

4-1.一硅肖特基势垒二极管有0.01 cm的接触面积,半导体中施主浓度为10

162cm

?3设?0?0.7V,VR?10.3V。计算

(1)耗尽层厚度;

(2)势垒电容;

(3)在表面处的电场

4-2.(1)从示于图4-3的GaAs肖特基二极管电容-电压曲线求出它的施主浓度、自建电

势势垒高度。

(2) 从图4-7计算势垒高度并与(1)的结果作比较。 4-3.画出金属在P型半导体上的肖特基势垒的能带结构图,忽略表面态。指出(1)?m??s 和(2)?m??s两种情形是整流节还是非整流结,并确定自建电势和势垒高度。

12?2?14-4.自由硅表面的施主浓度为10cm,均匀分布的表面态密度为Dss?10cmeV,

15?3电中性级为EV?0.3eV,计算该表面的表面势(提示:首先求出费米能级与电中性能

级之间的能量差,存在于这些表面态中的电荷必定与表面势所承受的耗尽层电荷相等)。 4-5.已知肖特基二极管的下列参数:?m?5.0V,?s?4.05eV,Nc?1019cm?3,

Nd?1015cm?3,以及k=11.8。假设界面态密度是可以忽略的,在300K计算:

(1)零偏压时势垒高度,自建电势,以及耗尽层宽度;

(2)在0.3v的正偏压时的热离子发射电流密度。

4-6.在一金属-硅的接触中,势垒高度为q?b?0.8eV,有效理查逊常数为

R*?102A/cm2?K2,Eg?1.1eV,Nd?1016cm?3,以及

Nc?Nv?1019cm?3。

(1)计算在300K,零偏压时半导体的体电势Vn和自建电势;

(2)假设Dp?15cm/s和Lp?10um,计算多数载流子电流对少数载流子电流的注入比。

4-7. 计算室温时金N-GaAs肖特基势垒的多数载流子电流对少数载流子电流的比例。

已知施主浓度为10

152cm?3,Lp?1um,?p?10?6s,以及R*?0.068R。

44-8. 在一金属-半导体势垒中,外电场?=10V/cm,介电常数为(1)k?4,(2)k?12,计算??和xm。

4-9.(1)推导出在肖特基二极管中dV载流子可以忽略。

(2)倘若在300K时,一般地V=0.25V以及?b?0.7V,估计温度系数。 4-10.肖特基检波器具有10 pF的电容,10?的串联电阻以及100?的二极管电阻,计

算它的截止频率。 参考文献 1. A..G.Milnes and D.L.Feucht, “Heterojunction and Metal-Semiconductor Junctions,”

Academic, New York, 1972.

2. C.A.Mead, Metal-Semiconductor Surface Barriers, Solid-State Electron.,

9:1023(1996). 3. E.H.Rhoderick, Comments on the Conduction Mechanism Schottky Diodes, J.Phys.D:

Appl.Phys., 5:1920-1929(1972).

4. A.Y.C.Yu, The Metal-Semiconductor Contact: An Old Device with a New Future,

dT作为电流密度的函数表达式。假设少数

IEEE Spectrum, 7:83-90(March 1970). 5. Crowley, A.M., and S.M.Sze.“Surface States and Barrier Height of

Metal-Semiconductor Systms.” Journal of Applied Physics 36 (1965), P.3212.

6. Pierret,R.F.Semiconductor Device Fundamentals.Reading,MA: Addison-Wesley,

1996.

7. Rideout, V.L.“A Review of the Theory, Technology and Applications of

Metal-Semiconductor Rectifiers.” Thin Solid Films 48, no.3(February 1, 1978), pp.261-291.

8. Singh, J.Semiconductor Devices: Basic Principles.New York: John Wiley and Sons,

2001.

9. Streetman, B.G.,and S.Banerjee.Solid State Electronic Devices.5th ed.Upper Saddle

River, NJ: Prentice-Hall, 2000.

10. Sze, S.M.Physics of Semiconductor Devices.2nd ed.New York: Wiley, 1981. 11. Wang, S.Fundamentals of Semiconductor Theory and Device Physics.Englewood Cliffs,

NJ: Prentice Hall, 1989.

12. Wolfe, C.M., N.Holonyak, Jr., and G.E.Stillman.Physical Properties of

Semiconductors.Englewood Cliffs, NJ: Prentice Hall, 1989.

13. Yang, E.S.Microelectronic Devices.New York: McGraw-Hill, 1988. 14.王家华等,半导体器件物理

第五章习题

5-1 硅N沟道JFET具有图5-1a的结构以及以下参数:Na?1018cm?3,

Nd?1015cm

?3,a=2?m,L?20?m和Z?0.2cm.计算:

(1)自建电势?0; (2)夹断电压 Vp0和Vp; (3)电 导G0;

(4)在栅极和漏极为零偏压时实际的沟道电导。

5-2. 试推导N沟道JEFT的电流与电压关系。它的截止面为2a×2a,为P区所包围,器件长度为L。

5-3. 推导结型场效应四级管的电流-电压关系,在该四级管中,两个栅极是分开的。

两个栅上的外加电压为VG1和VG2。假设为单边突变结。

5-4. 计算并画出在25、150和-50℃时习题5-1中JFET的转移特性。采用第一章给出

?的电子迁移率数据。栅电压的增量采用0.5V (计算机计算题)。 5-5.(1)计算并绘出在25℃时习题5-1中JFET的小信号饱和跨导;

(2)若rs=50?时,重复(1)(计算机计算题)。

5.6下图为结型场效应晶体管的低频小信号等效电路图,其中RS为源极电阻。证明:由

于RS的存在,晶体管的跨导变成

g'm?

IDSgm ?vgs1?gmRs,式中gm?IDS为忽略RS时的跨导。 vgsIDS _ Rs D

pv'' IDS gmgs?_

gmvg'sS

5-7. (1) 估算习题5-1中JFET的截止频率。

(2) 若L?2?m,重复(1); (3) 若采用N型GaAs,重复(1)。

5-8. 计算在VD?VP?5V和VG??1V时,习题5-1中JFET的漏极电阻rds。 5-9 一个N沟增强型GaAs MESFET在T=300K时,假设?b?0.89V。N沟道掺杂浓度

vg's

LNd?2?1015cm?3, VTH?0.25V。计算沟道厚度a。

5-10. 一N沟GaAs MESFET,其?b?0.9V,Nd?10cm,a?0.2?m,L?1?m,

17?3Z?10?m,(1)这是增强型器件还是耗尽型器件?(2)计算阈值电压或夹断电

压。(3)求VG?0时的饱和电流。(4)计算截止频率。

参考文献

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Sevin, L.J.Jr.:“Field Effect Transistors,” McGraw-Hill, New York, 1965. Chang, C.S., and D.Y.S.Day.“Analytic Theory for Current-Voltage Characteristics and Field Distribution of GaAs MESFETs.” IEEE Transactions on Electron Devices 36, no.2(February 1989), pp.269-80. Daring, R.B.“Subthreshold Conduction in Uniformly Doped Epitaxial GaAs MESFETs.” IEEE Transactions on Electron Devices 36, no.7(July 1989), pp.1264-73.

Drummond, T.J., W.T.Masselink, and H.Morkoc.“Modulation-Doped GaAs/(Al,Ga)As Heterojunction Field-Effect Transistors: MODFETs.”Proceedings of the IEEE 74, no.6(June 1986), pp.773-812. Fritzsche, D.“Heterostructures in MODFETs.” Solid-State Electronics 30, no.11(November 1987), pp.1183-95.

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Sze, S.M.Physics of Semiconductor Devices.2nd ed.New York: Wiley, 1981. Sze, S. Semiconductor Devices: Physics and Technology. New York: Wiley, 1985. Turner, J.A., R.S.Butlin, D.Parker, R.Bennet, A.Peake, and A.Hughes.“The Noise and Gain Performance of Submicron Gate Length GaAs FETs.” GaAs FET Principles and Technology.Edited by J.V.Di-Lorenzo and D.D.Khandelwal.Dedham, MA: Artech House, 1982.

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